Patent Filing•Grant Date: 2026-08-25
Patent: STATS ChipPAC Pte. Ltd.
Entity
STATS ChipPAC Pte. Ltd.
Grant Date
2026-08-25
Source Record
Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation
Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation