Patent Filing•Grant Date: 2026-08-18
Patent: Volantis Semiconductor, Inc.
Entity
Volantis Semiconductor, Inc.
Grant Date
2026-08-18
Source Record
COLD PLATE COOLING FOR WAFER-SCALE INTEGRATION WITH BACK SIDE MODULAR POWER DELIVERY
COLD PLATE COOLING FOR WAFER-SCALE INTEGRATION WITH BACK SIDE MODULAR POWER DELIVERY