Zhuhai ACCESS Semiconductor Co., LTD.
private
Total Raised
--
Contracts
--
Patents
3
PAC Giving
--
Government Contracts & Awards
No recent government contracts or awards found.
Proprietary Tech & Patents
METHOD FOR MANUFACTURING EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE
US 12765372 Oct 13, 2026
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
US 12672557 Jun 30, 2026
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
US 12672529 Jun 30, 2026
Form D Funding
No recent SEC Form D filings found.
Market Intelligence & News
No recent news or market intelligence found for this entity.
Key People
No individuals linked to this entity yet.
Political Giving
No disclosed PAC contributions found for this entity.
Factual Connections
Connections to other companies, executives, and politicians — sourced from disclosed trades, shared officers/directors, and public filings — are a Pro/Alpha feature.
Upgrade to Pro