HillSignal

SJ Semiconductor(Jiangyin) Corporation

private
Total Raised
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Contracts
--
Patents
3
PAC Giving
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Government Contracts & Awards

No recent government contracts or awards found.

Proprietary Tech & Patents

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME

US 12721161 Aug 25, 2026

FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

US 12713968 Aug 18, 2026

FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

US 12708056 Aug 11, 2026

Form D Funding

No recent SEC Form D filings found.

Market Intelligence & News

No recent news or market intelligence found for this entity.

Key People

No individuals linked to this entity yet.

Political Giving

No disclosed PAC contributions found for this entity.

Factual Connections

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